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HP0-D12 - Planning and Designing HP Infrastructure(R) Software Solutions - Dump Information

Vendor : HP
Exam Code : HP0-D12
Exam Name : Planning and Designing HP Infrastructure(R) Software Solutions
Questions and Answers : 128 Q & A
Updated On : October 15, 2018
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HP0-D12 Questions and Answers

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HP0-D12 Planning and Designing HP Infrastructure(R) Software Solutions

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HP0-D12 exam Dumps Source : Planning and Designing HP Infrastructure(R) Software Solutions

Test Code : HP0-D12
Test Name : Planning and Designing HP Infrastructure(R) Software Solutions
Vendor Name : HP
Q&A : 128 Real Questions

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HP Planning and Designing HP

HP Chromebook x360 14 unveiled with top rate convertible design | killexams.com Real Questions and Pass4sure dumps

HP has launched a new top class computing device running Google’s Chrome OS, the brand new HP Chromebook x360 14. This model boasts convertible functionality, what HP calls a top class design, and durability thanks partially to a protecting, decorative coating. in contrast to many Chromebooks, the Chromebook x360 has a fairly large display at 14-inches, and it also packs 8th-era Intel Core processors.

The HP Chromebook x360 14 facets a 14-inch Full HD IPS screen with a WLED backlight, multitouch help, and an part-to-part design. patrons have a couple processor alternate options, the eighth-technology Intel Core i3 and i5, these joined with the aid of 64GB eMMC inner storage and 8GB of RAM.

The Chromebook will also be used with Skype and equivalent video chatting application due to a built-in HP extensive vision HD webcam with dual-array digital microphones. A 360-diploma hinge makes the Chromebook x360 a “convertible” model, enabling the display to be rotated lower back into one in every of 4 diverse modes.

The chassis is steel and lined with what HP calls a “ceramic-like” conclude, the outcomes being something that appears like ceramic but maintains a more robust stage of durability. Connectivity is relatively general with Bluetooth four.2 and 802.11b/g/n/ac WiFi. different features encompass battery existence lasting up to 13 hours and 30 minutes per charge, a “barely seen bezel,” and B&O PLAY audio alongside twin speakers.

The HP Chromebook x360 14 is now attainable to preorder from HP.com and BestBuy.com for $599 USD; the device may still be obtainable to purchase in optimal purchase stores, as neatly, beginning on October 21.


HP’s new leather desktop tries to reinvent the computing device | killexams.com Real Questions and Pass4sure dumps

an open laptop computer sitting on top of a table © photograph by way of Tom Warren / The Verge

HP is attempting whatever thing different with its newest convertible desktop, and boldly claiming it’s “reinventing the workstation.” whereas most laptops are housed in an aluminum or plastic chassis, HP’s Spectre Folio is wrapped in leather-based that morphs into different modes. That may sound like each different 2-in-1 on the market, however you handiest must examine HP’s Spectre Folio to see it’s a little different.

HP has created a skeleton magnesium frame that attaches to the exterior leather-based and mixed it with a tiny motherboard to maximize the volume of battery on this gadget. HP is claiming as much as 18 hours of battery life, an magnificent volume if the claims dangle up. internal, there’s an 8th Gen Intel Core i7 processor, 8GB of RAM, and 256GB of SSD storage. HP is using a 13.3-inch FHD reveal with Intel’s newest 1W panel to maximise battery life. there will also be a 4K reveal choice later this 12 months.

The Spectre Folio collapses like a journal

It’s the body of the Spectre Folio that basically makes it distinctive, even though. HP has used leather to create a device that collapses down like a magazine, and it even includes a backbone and stitching so it feels like a publication when it’s closed. The mode switching is fairly seamless, too. you could use it in a standard desktop mode or pull the reveal forward to fit it right into a media mode the place the keyboard is covered by means of the screen. The trackpad continues to be on the entrance so you can navigate round if want be with no need to touch the reveal. once in media mode, that you could then push the reveal flat down right into a tablet mode.

HP’s bold declare of “reinventing the workstation” will deserve to be verified with reports of the Spectre Folio, but i was impressed on the engineering of the machine right through some quick time with it final month. I’ve been watching pc makers attempt wild design after wild design ever considering Microsoft launched its windows eight operating device, and there’s nonetheless now not an ideal 2-in-1. There’s always a compromise along the way, whether it’s a heavy tablet or an awkward laptop mode. HP thinks it has perfected this design with the Spectre Folio so it could actually manage both well.

”This design is so clean from computing device to pill,” says Stacy Wolff, vp of design at HP. It’s one of the quickest… really within the trade.” I discovered it very quickly to switch between modes, but the huge check for any 2-in-1 is how the desktop mode feels for your lap. It changed into pretty sturdy and neatly-balanced; after I reached out to the touch the screen, there was no aggravating display wobble, and it didn’t suppose suitable heavy. The only disappointing a part of this mode is a compromise on the attitude of the reveal. that you would be able to’t push it far-off from you, which is nice if you’re using it on a desk but now not if you happen to might wish to adjust the monitor perspective extra to stay away from monitor glare. The monitor also has a rather massive chin on it, and i would have preferred to see a more bezel-less panel like Dell’s XPS 13.

a laptop computer sitting on top of a table © supplied by using Vox Media, Inc.

The pill mode is largely what you’d are expecting, and there’s even a stylus with guide for tilting and greater than 4,000 levels of sensitivity. that you could angle the reveal a little bit when it’s in tablet mode, nonetheless it’s a long way sturdier when it’s flat. the entire different modes are supported by means of magnets, so there aren't any buttons or locks to fiddle with. HP has additionally saved a full aluminum keyboard with 1.5mm key go back and forth and a tumbler trackpad, and that i discovered both had been similar to most Spectre laptops throughout my quick testing.

i was shocked HP didn’t consider an ARM-powered version of its Spectre Folio and even a 10-inch version. “We needed to work in intense partnership with Intel,” explains Wolff. “Did we analyze others? We did, however it was a short journey as a result of we really wanted to set the bar at that premium level.” It doesn’t sound like a ten-inch edition is within the works, either. Wolff says “there’s lots of noise and a lot of diverse kind factors” in the 10-inch area, and it’s not always about the productiveness gadgets HP is primary for.

HP is pushing towards extra top rate devices

both manner, leather is clearly the important thing part of this design. It’s there to make the Spectre Folio consider more top rate and like a ebook when it’s folded away. How that leather-based holds up, notably on the palm rests, should be enjoyable to see. HP isn’t releasing any class of treatment for the leather-based, and any wear might possibly be similar to Microsoft’s floor computing device. “it's designed for disassembly,” says Wolff, hinting that the leather exterior might get replaced sooner or later.

apart from the leather, it’s clear HP is experimenting with the Folio. It’s hiring animators and vogue designers in what feels like a bigger push to capture one of the most top rate computer market that Apple has dominated. Microsoft has additionally tried an analogous strategy with its surface line, and HP obviously desires a desktop that stands out.

HP is planning to liberate this Spectre Folio as a top of the line purchase exclusive and on HP.com. An Intel Core i5 model could be priced at $1,299, and the Core i7 mannequin will be $1,399. There’s even an LTE variant with a Core i7 processor for $1,499, and the 4K screen alternative and burgundy colour can be attainable in December.

photography by Tom Warren / The Verge


HP Expands Chromebook Portfolio, Unveils Chromebook x360 14 | killexams.com Real Questions and Pass4sure dumps

No outcome discovered, are trying new keyword!HP is likely to face challenges from Google itself, which is planning to launch its first Chrome OS tablet, Google Pixel Slate. Acer also lately unveiled its first line of excessive-conclusion laptops ...

HP0-D12 Planning and Designing HP Infrastructure(R) Software Solutions

Study Guide Prepared by Killexams.com HP Dumps Experts


Killexams.com HP0-D12 Dumps and Real Questions

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HP0-D12 exam Dumps Source : Planning and Designing HP Infrastructure(R) Software Solutions

Test Code : HP0-D12
Test Name : Planning and Designing HP Infrastructure(R) Software Solutions
Vendor Name : HP
Q&A : 128 Real Questions

Need to-the-point knowledge of HP0-D12 topics!
With the use of exceptional products of killexams.com, I had scored ninety two percentage marks in HP0-D12 certification. i waslooking for reliable observe fabric to boom my information stage. Technical standards and difficult language of my certification changed into hard to recognize therefore i used to be searching for reliable and clean take a look atproducts. I had come to realize this internet site for the instruction of expert certification. It was not an clean task butonly killexams.com has made this task easy for me. im feeling excellent for my achievement and this platform is satisfactory for me.


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HP and Siemens expand opportunities for 3D design and additive manufacturing innovation | killexams.com real questions and Pass4sure dumps

June 04, 2018 08:00 ET | Source: HP Inc.

photo-release

Siemens and HP Color 3D Printed Surgical Cutting Guide

Siemens and HP are expanding innovation for industrial 3D printed parts with full color. For example, personalized surgical instruments can be produced by 3D printing with unique ID, both human and machine readable.

HP Inc.

News highlights:                         

  • Industry leaders expand strategic partnership, extending technology alignment for next-generation products that are 3D printed in full color
  • Expansion of Siemens’ additive design and manufacturing software to support HP’s new full-color 3D printers
  • HP Jet Fusion 3D 300/500 series enables concept prototyping as well as short-run production for end-use products 
  • Addition of HP Multi Jet Fusion 3D printing technology to Siemens’ Additive Manufacturing Experience Center in Erlangen, Germany
  • PHOENIX, June 04, 2018 (GLOBE NEWSWIRE) -- Today at Siemens PLM Connection Americas 2018, one of the largest events for Siemens’ PLM software users, HP Inc. and Siemens expanded their longstanding collaboration to enable even more advanced functionality across a broader set of Siemens PLM software to change the way users can design and manufacture with HP’s Multi Jet Fusion 3D printing technology.

    Siemens’ NX and Solid Edge Software deliver support for Full-Color 3D Printing Capabilities through HP Multi Jet Fusion

    With the latest releases, Siemens, a leader in digital innovation software, and HP, the global industry leader in 3D printing, will enable users of Siemens’ NX™ software and Solid Edge® software to design and produce full color 3D-printed parts. HP’s Jet Fusion 3D 300/500 series is the industry’s first 3D printing solution for the production of engineering-grade, functional parts in full color, black or white – with voxel-level control – in a fraction of the time of other solutions.

    The Jet Fusion 3D 300/500 series also supports the leading color file formats including 3MF, enabling designers to easily produce the color parts they want with a reliable workflow. Users taking advantage of NX and Solid Edge for HP’s Multi Jet Fusion technology will have access to 3MF files ready for HP’s entire portfolio of printers including the industrial-grade HP Jet Fusion 4200/4210 and 300/500 solutions.

    “Our users will now be able to apply the power and flexibility of Siemens’ NX and Solid Edge product design software to HP’s groundbreaking 3D printing technology, opening a world of new design possibilities with the availability of full-color parts,” said Tony Hemmelgarn, president and CEO, Siemens PLM Software. “We share HP’s vision that 3D printing is empowering companies to reinvent their product lifecycles to prosper and thrive in manufacturing’s all-digital future. Expanding our partnership with HP allows us to continue to elevate additive manufacturing for end-use parts at industrial scale.”

    The combination of the two leading digital manufacturing technologies dramatically expands the potential applications for Siemens’ market-leading digital innovation software and HP’s disruptive Multi Jet Fusion 3D printing technology. Customers will have the ability to quickly and economically prototype and produce new designs and end-part applications with advanced voxel capabilities. In addition, the collaboration creates new opportunities to accelerate the adoption of 3D printing at an industrial scale for customers and partners that participate in Siemens’ Additive Manufacturing Network.

    “Adding the full-color capabilities of HP’s expanded Multi Jet Fusion platform to Siemens’ market-leading design and manufacturing solutions creates an immense new set of possibilities for products and applications,” said Stephen Nigro, President of 3D Printing, HP Inc. “It is exciting to deliver the power of our technologies to customers large and small, fundamentally changing the 3D printing end-to-end process, from design to prototyping and ultimately manufacturing. This is another pivotal step not just for our companies, but for the entire global manufacturing ecosystem, as together with Siemens we change the way the world designs and manufactures.”

    Multi Jet Fusion 3D Technology Showcased in Siemens’ Additive Manufacturing Experience Center

    HP’s Multi Jet Fusion 3D printing technology will also be showcased as a foundational 3D printing platform in Siemens’ Additive Manufacturing Experience Center in Erlangen, Germany, which invites customers to discover the latest additive manufacturing technologies and their applications first-hand in a design and manufacturing showroom environment.

    Siemens and HP share the objective to accelerate the digital transformation of the manufacturing industry, providing all of the necessary capabilities, from generative design for product innovation through 3D printing for industrial-scale manufacturing. Through generative design, companies can automate innovative designs directly from functional requirements which can result in enhanced functional performance for parts and products. Using HP Multi Jet Fusion technology, companies can manufacture these innovative parts more economically at larger production volume. Together, HP’s 3D printing solutions and Siemens’ technology combine in a single integrated solution that enables businesses to reimagine products, reinvent manufacturing and rethink business models.

    Changing the Way the World Designs and Manufactures

    Stephen Nigro, president of HP 3D Printing, will join Robert Jones, executive vice president of global sales and services for Siemens PLM Software, on the PLM Connection mainstage on Monday, June 4 at 5:00 p.m. to share more about these expanded offerings for Siemens’ PLM users.

    About SiemensSiemens PLM Software, a business unit of the Siemens Digital Factory Division, is a leading global provider of software solutions to drive the digital transformation of industry, creating new opportunities for manufacturers to realize innovation. With headquarters in Plano, Texas, and over 140,000 customers worldwide, Siemens PLM Software works with companies of all sizes to transform the way ideas come to life, the way products are realized, and the way products and assets in operation are used and understood. For more information on Siemens PLM Software products and services, visit www.siemens.com/plm.

    About Siemens AGSiemens AG (Berlin and Munich) is a global technology powerhouse that has stood for engineering excellence, innovation, quality, reliability and internationality for more than 165 years. The company is active in more than 200 countries, focusing on the areas of electrification, automation and digitalization. One of the world’s largest producers of energy-efficient, resource-saving technologies, Siemens is No. 1 in offshore wind turbine construction, a leading supplier of gas and steam turbines for power generation, a major provider of power transmission solutions and a pioneer in infrastructure solutions as well as automation, drive and software solutions for industry. The company is also a leading provider of medical imaging equipment – such as computed tomography and magnetic resonance imaging systems – and a leader in laboratory diagnostics as well as clinical IT. In fiscal 2015, which ended on September 30, 2015, Siemens generated revenue of €75.6 billion and net income of €7.4 billion. At the end of September 2015, the company had around 348,000 employees worldwide. Further information is available on the Internet at www.siemens.com.

    About HP HP Inc. creates technology that makes life better for everyone, everywhere. Through our portfolio of printers, PCs, mobile devices, solutions and services, we engineer experiences that amaze. More information about HP Inc. is available at http://www.hp.com/go/3Dprinting.

    Note: Siemens, the Siemens logo and Simatic IT are trademarks or registered trademarks of Siemens AG. NX and Solid Edge are trademarks or registered trademarks of Siemens Product Lifecycle Management Software Inc. or its subsidiaries in the United States and in other countries. All other trademarks, registered trademarks or service marks belong to their respective holders.

    Forward-Looking StatementsThis news release contains forward-looking statements that involve risks, uncertainties and assumptions. If the risks or uncertainties ever materialize or the assumptions prove incorrect, the results of HP Inc. and its consolidated subsidiaries (“HP”) may differ materially from those expressed or implied by such forward-looking statements and assumptions.

    All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to any projections of net revenue, margins, expenses, effective tax rates, net earnings, net earnings per share, cash flows, benefit plan funding, deferred tax assets, share repurchases, currency exchange rates or other financial items; any projections of the amount, timing or impact of cost savings or restructuring and other charges; any statements of the plans, strategies and objectives of management for future operations, including the execution of restructuring plans and any resulting cost savings, revenue or profitability improvements; any statements concerning the expected development, performance, market share or competitive performance relating to products or services; any statements regarding current or future macroeconomic trends or events and the impact of those trends and events on HP and its financial performance; any statements regarding pending investigations, claims or disputes; any statements of expectation or belief; and any statements of assumptions underlying any of the foregoing.

    Risks, uncertainties and assumptions include the need to address the many challenges facing HP’s businesses; the competitive pressures faced by HP’s businesses; risks associated with executing HP’s strategy; the impact of macroeconomic and geopolitical trends and events; the need to manage third-party suppliers and the distribution of HP’s products and the delivery of HP’s services effectively; the protection of HP’s intellectual property assets, including intellectual property licensed from third parties; risks associated with HP’s international operations; the development and transition of new products and services and the enhancement of existing products and services to meet customer needs and respond to emerging technological trends; the execution and performance of contracts by HP and its suppliers, customers, clients and partners; the hiring and retention of key employees; integration and other risks associated with business combination and investment transactions; the results of the restructuring plans, including estimates and assumptions related to the cost (including any possible disruption of HP’s business) and the anticipated benefits of the restructuring plans; the resolution of pending investigations, claims and disputes; and other risks that are described in HP’s Annual Report on Form 10-K for the fiscal year 2017, and HP’s other filings with the Securities and Exchange Commission. HP assumes no obligation and does not intend to update these forward-looking statements. HP’s Investor Relations website at http://www.hp.com/investor/home contains a significant amount of information about HP, including financial and other information for investors. HP encourages investors to visit its website from time to time, as information is updated, and new information is posted.

    A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/50631136-8627-49c7-85e0-17591290cd6b


    Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation | killexams.com real questions and Pass4sure dumps

    SAN JOSE, Calif.--(BUSINESS WIRE)--

    Highlights:

  • Cadence digital, signoff and custom/analog tools achieve latest DRM and SPICE certifications for TSMC 5nm and 7nm+ process technologies
  • Early customers using Cadence tools for 5nm design projects ranging from initial bring-up to full production development; customers in production with 7nm+ projects
  • Cadence Design Systems, Inc. (CDNS) today announced its continued collaboration with TSMC to certify its design solutions for TSMC 5nm and 7nm+ FinFET process technologies for mobile and high-performance computing (HPC) designs. As part of the collaboration, the Cadence® digital, signoff and custom/analog tools have achieved the latest Design Rule Manual (DRM) and SPICE certification for the TSMC 5nm and 7nm+ processes, and the corresponding process design kits (PDKs) are now available for download. Customers using Cadence’s implementation, signoff and custom/analog tools are already in production with 7nm+ projects, and there are multiple design projects underway with early 5nm customers.

    To learn more about the Cadence full-flow digital and signoff advanced-node solutions, visit www.cadence.com/go/tsmc5and7nmdandsoip. For information about the Cadence custom/analog advanced-node solutions, visit www.cadence.com/go/tsmc5and7nmcandaoip.

    5nm and 7nm+ Digital and Signoff Tool Certification

    Cadence delivered a fully integrated digital implementation and signoff tool flow, which has been certified by TSMC for the latest versions of the 5nm and 7nm+ processes. For the 7nm+ process, the Cadence full-flow includes the Innovus™ Implementation System, Quantus™ Extraction Solution, Tempus™ Timing Signoff Solution, Voltus™ IC Power Integrity Solution, Voltus-Fi Custom Power Integrity Solution and Physical Verification System (PVS). For the 5nm process, the Cadence certified tools include the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution and Voltus-Fi Custom Power Integrity Solution.

    Cadence digital and signoff tools optimized for TSMC’s 5nm and 7nm+ process provide EUV support at key layers and associated design rules that enable customers to achieve power, performance and area (PPA) savings at these advanced nodes. Some of the newest enhancements for the 5nm and 7nm+ process include via pillar-aware synthesis and feed forward guidance with the Genus™ Synthesis Solution as well as a pin-access control routing method for cell electromigration (EM) handling and statistical EM budgeting support.

    5nm and 7nm+ Custom/Analog Tool Certification

    The Cadence-certified custom/analog tools for the latest versions of the TSMC 5nm and 7nm+ process technologies include the Spectre® Accelerated Parallel Simulator (APS), Spectre eXtensive Partitioning Simulator (XPS), Spectre RF Option and Spectre Circuit Simulator, as well as the Virtuoso® custom IC design platform, which consists of the Virtuoso Schematic Editor, Virtuoso Layout Suite, Virtuoso ADE Product Suite and Virtuoso Integrated Physical Verification System. The Layout-Dependent Effect (LDE) Electrical Analyzer is also certified for 7nm+, and the collaboration on 5nm is ongoing.

    By continually enhancing design methodologies and capabilities included with the Virtuoso Advanced Node Platform for TSMC’s advanced-node processes, customers can achieve better custom physical design throughput versus traditional non-structured design methodologies via the advanced capabilities in the Virtuoso and Spectre tools.

    The Virtuoso Advanced Node Platform methodology consists of features and functionality required for creating 5nm and 7nm+ designs including mixed-signal functional verification, reliability analysis and an accelerated custom placement and routing methodology, which enables customers to improve productivity and meet power, multi-patterning, density and EM requirements. Cadence also introduced new features including end-to-end constraint support, dummy insertion and advanced MIMCAP support specifically for the 5nm process.

    5nm and 7nm+ Library Characterization Tool Flow

    In addition to the tools certified for TSMC’s 5nm and 7nm+ process technologies, the Liberate™ Characterization portfolio and the Liberate Variety™ Statistical Characterization Solution have been validated to deliver accurate Liberty libraries including advanced timing, noise and power models. The solutions utilized innovative methods to characterize Liberty Variation Format (LVF) models, enabling accurate process variation signoff for low-voltage applications and to create EM models enabling signal EM optimizations and signoff.

    Story Continues

    “Our 5nm process has matured to a great degree with customers doing early design starts, while our 7nm+ technology is production ready and actively in use with mutual customers,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “By collaborating closely with Cadence, we’re enabling customers to deliver innovations using our latest technologies and the Cadence certified tools and flows.”

    “We’ve continued our close collaboration with TSMC on advancing 5nm and 7nm+ FinFET adoption by providing customers with access to the latest technical capabilities for advanced-node design creation,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “Based on aggressive new R&D optimizations and performance improvements to our digital and signoff and custom/analog tools, customers can deliver innovative, reliable end products in their respective markets within tight timelines.”

    About Cadence

    Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at cadence.com.

    © 2018 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

    View source version on businesswire.com: https://www.businesswire.com/news/home/20181001005260/en/


    The Semiconductor Industry Is in Transition | killexams.com real questions and Pass4sure dumps

    Companies are beginning to acknowledge the potential of new markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data center to the mobile edge. More specifically, with eroding ASPs (average selling prices) and increasingly prohibitive design costs at ever lower nodes, many companies are searching for fresh revenue streams across a wide range of verticals comprising the Internet of Things (IoT).

    However, with the IoT install base expected to increase by about 15% to 20% annually through 2020, security is currently perceived as both a major opportunity and a considerable challenge for the semiconductor industry.

    In addition to services, the concept of open-source hardware (OSH) and building silicon from disaggregated, pre-verified chiplets is beginning to gain serious traction as companies move to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the full potential of silicon and services will undoubtedly vary, which is why it’s important for us to explore a future in which semiconductor companies, along with various industries, organizations, and government offices, play an open and collaborative role in helping to sustainably monetize both silicon and services.

    Acquisitions and industry consolidation continued apace in 2016 and 2017:

  • Analog Devices acquired Linear Technology
  • Infineon acquired International Rectifier
  • ROHM acquired Powervation
  • Renesas acquired Intersil
  • Major semiconductor players positioned themselves to better compete across multiple verticals, including cloud-based computing, artificial intelligence (AI), and self-driving vehicles. According to KPMG, many companies increasingly see Mergers & Acquisitions (M&A) as the only way to drive real revenue growth, giving a new emphasis to the “make vs. buy” question, with many selecting the “buy” answer.

    Concurrently, chip development costs continued to rise and saliently affect the number of designs at advanced nodes. More specifically, the total number of Advanced Performance Multicore first-time SoC design starts has been roughly flat to only slightly up over the past five years. Although design price tags have been steadily increasing since 40 nm, analysts are most concerned with the acceleration of design costs at 7 nm and 5 nm.

    As Rich Wawrzyniak, a senior analyst at Semico Research confirms, design starts beyond 10 nm will be constrained by rising development costs. While the total number of designs that migrate to new nodes may not be appreciably different than previous process geometry upgrades, Wawrzyniak says the time frame for such transitions by the majority of companies will be more protracted.

    New models for both R&D and revenue are clearly needed, as heightened industry consolidation and eroding ASPs are unsustainable in the long term. This is precisely why the industry is looking toward the Internet of Things to create additional revenue streams, with McKinsey Global Institute (MGI) analysts estimating the IoT could have an annual economic impact of $3.9 to $11.1 trillion by 2025 across multiple verticals. However, with the IoT install base expected to increase by about 15% to 20% annually through 2020, security is considered to be both a major opportunity and challenge for semiconductor companies.

    As such, MGI recommends creating security solutions that allow for semiconductor companies to expand into adjacent business areas and develop new business models. For example, companies could help create end-to-end security offerings, which are essential to the IoT’s success. Ideally, says MGI, the industry should play a leading role when developing such offerings, to ensure they obtain their fair share of the value chain.

    From our perspective, end-to-end IoT security solutions deployed as a platform as a service (PaaS) are critical in helping semiconductor companies generate renewable, downstream revenue for specific services. For customers, PaaS offers an easy way for customers to securely develop, run, and manage applications and devices without the complexity of building and maintaining elaborate infrastructure.

    Such security solutions, which could also leverage a hardware-based root-of-trust, should support device identification and mutual authentication (verification), routine attestation checks, secure over-the-air (OTA) device updates, disaster recovery and key management, as well as the decommissioning and reassignment of keys to better manage devices and mitigate various attacks, including distributed denial of service (DDoS).

    Smart Cities

    Inaccessible silicon—such as chips embedded in IoT smart-city infrastructure—could offer semiconductor companies the opportunity to implement a long-term PaaS “silicon to services” model. Indeed, future smart-city infrastructure will almost certainly be designed with chips in difficult-to-reach locations, including subterranean water pipes, air-conditioning ducts, and under streets and parking lots.

    Intelligent street lighting, responsive signage, and next-gen Bluetooth beacons also require future-proofing to avoid constant physical maintenance and upgrades. Therefore, silicon powering smart-city infrastructure should be capable of supporting secure in-field feature configuration, along with various PaaS-based services like advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers.

    Smart Homes

    The global smart-home market is projected to reach at least $40 billion in value by 2020. According to Markets and Markets, the growth of the smart-home space can be attributed to multiple factors, including significant advances in the IoT sector; increasing requirements for consumer convenience, safety, and security; a more pronounced need for energy-saving, and low-carbon-emission-oriented solutions. However, as we previously discussed, it’s critical to ensure that IoT security is implemented at the product design stage to prevent malicious actors from exploiting smart-home devices and causing service interruptions.

    In addition to potentially lucrative cybersecurity opportunities for semiconductor companies, smart-home devices offer the promise of creating recurring revenue streams to support a sustainable “silicon to services” model. As an example, MarketingInsider's Christoper Dean highlights Amazon’s popular Echo devices. With at least 15 million Echoes already sold, Echo users are likely to double as active Amazon consumers, leveraging the device to monitor wishlists and discover items they’re subsequently prompted to purchase. Meanwhile, Nest is using thermostat data as a platform to offer energy-management services to utility companies across the United States, with companies paying for meaningful and actionable customer information on a subscription basis.

    Automotive

    According to IC Insights, chip sales for automotive systems and the IoT will grow 70% faster than total IC revenues between 2016 and 2021. Specifically, IC sales for automobiles and other vehicles are forecast to jump from $22.9 billion in 2016 to $42.9 billion in 2021, while revenues for IoT functionality will increase from $18.4 billion in 2016 to $34.2 billion in 2021.

    The projected increase in automotive chip sales is hardly surprising, as modern vehicles are essentially a network of networks equipped with a range of embedded communication methods and capabilities. However, this means vehicles are now more vulnerable to cyberattacks than ever before.

    Potential security vulnerabilities include unprotected vehicle-to-vehicle communication, the unauthorized collection of driver or passenger information, seizing control of critical systems such as brakes or accelerators, intercepting vehicle data, tampering with third-party dongles, and altering over-the-air (OTA) firmware updates. In terms of the latter, automotive manufacturers are now focusing on providing secure OTA updates for various systems, with the global automotive OTA update market projected to grow at a CAGR of 18.2% from 2017 to 2022 and reach $3.89 billion by 2022.

    Automotive manufacturers are also working to ensure that the vehicle supply chain is kept free of stolen and counterfeit components. Nevertheless, a wide range of gray-market devices can still be found powering high-value modules such as in-vehicle infotainment systems and headlights, as well as in critical safety systems including airbag modules, braking modules, and powertrain controls. Shielding vehicle peripherals and components against tampering by implementing a range of layered hardware and software security solutions have therefore become a priority for a number of automotive manufacturers.

    In addition to implementing layered security solutions, the semiconductor industry would clearly benefit from adopting an IoT "as-a-service" approach to the automotive sector. As an example, companies could deploy sensor-based vehicle systems that proactively detect potential issues and malfunctions. This solution, which, in its most optimal configuration, would combine silicon and services, could be sold as a hardware and software product, or deployed as a service with subscription fees generated on a monthly or annual basis.

    Medical and Healthcare

    Long-life implanted medical devices will undoubtedly require a high degree of future-proofing from the semiconductor industry to avoid frequent physical upgrades and maintenance. Srihari Yamanoor, an R&D design specialist at Stellartech Research Corp., notes that medical devices will ultimately be customized to meet the needs of individual patients, thereby increasing the application of precision medicine.

    Moreover, the health insurance industry is expected to leverage machine learning to optimize and reduce the cost of care, while digital health devices will also be used by the insurance industry to identify at-risk patients and provide assistance. Medical devices, especially implantable models, should therefore be designed to support a “silicon to services model” via in-field feature configuration and secure OTA updates, as well as PaaS-based services, including the collection and analysis of relevant data; proactive maintenance, advanced algorithms; and an intuitive UI for both patients and doctors.

    Open-Source Hardware and Disaggregated Chiplets

    Alongside services, open-source hardware offered by organizations and companies such as RISC-V and SiFive have begun to positively disrupt the semiconductor industry by encouraging innovation, reducing development costs and accelerating time-to-market.

    The success of open-source software—as opposed to a closed, walled-garden approach—continues to set an important precedent for the semiconductor industry. Faced with prohibitively expensive development costs, a number of companies are opting to avoid unnecessary toll collectors while placing more of an emphasis on open-source architecture as they work to create new service-centric revenue streams.

    In addition to open-source hardware, the concept of building silicon from pre-verified chiplets is beginning to gain traction as the semiconductor industry moves to slash costs and reduce time-to-market for heterogeneous designs. According to Semiconductor Engineering's Ann Steffora Mutschler, the chiplet concept has been on the drawing board for some time, although it was historically perceived as a potential future direction rather than a tangible solution in the shadow of waning Moore’s Law. This perception is beginning to shift as design complexity increases, particularly at advanced nodes (10/7 nm), and as new markets that require semi-customized solutions coalesce.

    The concept of pre-verified chiplets has piqued the interest of the U.S. Defense Advanced Research Projects Agency (DARPA), which recently rolled out its Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. In collaboration with the semiconductor industry, the successful implementation of CHIPS would see a range of IP blocks, subsystems, and chips combined on an interposer in a 2.5D-like package.

    The CHIPS initiative took center stage in August 2017, when participants from the military, commercial, and academic sectors gathered at DARPA headquarters at the official kickoff meeting for the Agency’s Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program.

    As DARPA's Dr. Daniel Green detailed during the conference, the program seeks to develop a new technological framework in which different functionalities and blocks of intellectual property—among them, data storage, computation, signal processing, and managing the form and flow of data—can be segregated into small chiplets. They then can be mixed, matched, and combined onto an interposer, somewhat like joining the pieces of a jigsaw puzzle. In fact, says Green, an entire conventional circuit board with a variety of different but full-sized chips could ultimately be shrunk down onto a much smaller interposer hosting a huddle of yet far smaller chiplets.

    According to DARPA, specific technologies that could emerge from the CHIPS initiative include compact replacements for entire circuit boards, ultra-wideband radio frequency (RF) systems, and fast-learning systems for extracting interesting and actionable information from much larger volumes of mundane data.

    Perhaps not surprisingly, the semiconductor industry is already eyeing a disaggregated approach in the form of SerDes chiplets and specialized low-power, application-specific die-to-die interfaces. To be sure, viable silicon disaggregation can be achieved by moving high-speed interfaces like SerDes to separate die in the form of SerDes chiplets, shifting analog sensor IP to separate analog chips and implementing very low-power and low-latency die-to-die interfaces through MCM or through an interposer using 2.5D technology.

    Beyond leveraging known-good die for SerDes in more mature nodes (N-1) or vice versa, disaggregation is expected to facilitate the creation of multiple SKUs, while optimizing cost and reducing risk. More precisely, disaggregation will see SoCs broken out into higher-yielding, smaller dies and allow companies to create specific designs with multiple variants. Indeed, die-to-die interfaces can more easily accommodate diverse applications across memory, logic and analog technology. In addition, die-to-die interfaces don’t require a matching line/baud rate and number of lanes, while FEC may or may not be required depending on latency requirements.

    It should be noted that multiple companies are actively pursuing SoC/ASIC aggregation for switches and other systems. Similarly, the semiconductor industry is developing ASICs with die-to-die interfaces on leading FinFET nodes, while at least one next-generation server chip is being designed with disaggregated I/Os on a separate die.

    Conclusion

    Over the past five years, the semiconductor industry has faced numerous complex challenges. These include increased development costs, eroded ASPs, market saturation, and heightened, yet unsustainable M&A activity. Through 2018, the semiconductor industry continues to seek a return to stability and organic growth within the parameters of a new business paradigm that’s both viable and collaborative. Within this context, semiconductor companies are acknowledging the potential of new markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data center to the mobile edge.

    This includes end-to-end IoT security solutions and PaaS-based services such as in-field feature configuration, advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers. In addition to services, the concept of open-source hardware and building silicon from disaggregated, pre-verified chiplets is beginning to gain traction as companies move to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the full potential of semiconductors will undoubtedly vary, which is why it’s important for us to explore a future in which the industry, along with various research organizations and government offices, plays an open and collaborative role in helping to sustainably monetize both silicon and services.

    For more information on this topic, check out Rambus’ site.

    Shrikant Lohokare, Ph.D., is Vice President and Executive Director, North America for the Global Semiconductor Alliance.



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